設備特點：

? Easy operation and maintenance by soft were are calibration.

軟件標準，操作方便，維護方便

? 6~8 inch and 8~12 inch wafer capability.

6- 8英寸和8~12英寸晶圓能力

? Tape capable of normal and UV tape.

可滿足普通膠帶和UV膠帶

? High accuracy lamination by pre-aligner.

高精度貼合

? Air bubble free lamination.

無氣泡分層

? Adjustable cutting blade angle.

切割刀片角度可調

? Precision edge cutting for optimum wafer backgrounding.

精確的邊緣切割，滿足最佳的圓片研磨

? No tape burrand tail after lamination.

覆膜后無帶毛刺和帶尾

? Minimum tape consumption.

最小的膠帶損耗

? Easy tape setting by onetouch locker.

一鍵鎖止裝置輕松設置膠帶

? High precise robotic handler.

高精度自動機械臂

? Quick and easy conversion for different size wafer.

快速和簡單的轉換，不同尺寸的晶圓

? Capable of Bumping wafer by special bond roller.

可通過特殊的粘接滾筒進行壓片